The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 31, 2018
Filed:
Mar. 31, 2015
Shindengen Electric Manufacturing Co., Ltd., Chiyoda-ku, Tokyo, JP;
Ryo Matsubayashi, Saitama, JP;
SHINDENGEN ELECTRIC MANUFACTURING CO., LTD., Tokyo, JP;
Abstract
Provided is a bonding device for bonding a substrate and an electronic part of an assembled body which is formed by mounting the electronic part on the substrate with a metal particle paste sandwiched therebetween. The bonding device is configured to bond the substrate and the electronic part to each other by heating a pressure applying unit having a first transfer member and a second transfer member which transfer pressure and heat to the assembled body n a state where the assembled body is sandwiched between the first transfer member and the second transfer member while applying pressure to the pressure applying unit. The bonding device further includes a heating mechanism part having a first heating part and a second heating part arranged at positions opposite to each other, a positioning mechanism part, and a pressure applying mechanism part.