The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 25, 2018
Filed:
Mar. 31, 2015
Shindengen Electric Manufacturing Co., Ltd., Chiyoda-ku, Tokyo, JP;
Ryo Matsubayashi, Saitama, JP;
Yuji Morinaga, Saitama, JP;
SHINDENGEN ELECTRIC MANUFACTURING CO., LTD., Tokyo, JP;
Abstract
Provided is a method of manufacturing a bonded body having a structure where a substrate and an electronic part are bonded to each other with a metal particle paste interposed therebetween. The method includes an assembled body forming step where the electronic part is mounted on the substrate with the metal particle paste interposed therebetween, an assembled body arranging step of arranging the assembled body between two heating plates opposite to one another, and a bonding step of bonding the substrate and the electronic part to each other by heating while applying pressure to the assembled body by moving at least one of two heating plates to the other of two heating plates. The bonding step is performed under a condition that a temperature of the assembled body is within 0° C. to 150° C. In the bonding step, a metal particle paste minimally generates a sintering reaction.