Shindengen Electric Manufacturing Company Limited

Applied Nanoparticle Laboratory Corporation

Ryo Matsubayashi

Teruo Komatsu

Yuji Morinaga

Provided is a method of manufacturing a bonded body having a structure where a substrate and an electronic part are bonded to each other with a metal particle paste interposed therebetween. The method includes an assembled body forming step where the electronic part is mounted on the substrate with the metal particle paste interposed therebetween, an assembled body arranging step of arranging the assembled body between two heating plates opposite to one another, and a bonding step of bonding the substrate and the electronic part to each other by heating while applying pressure to the assembled body by moving at least one of two heating plates to the other of two heating plates. The bonding step is performed under a condition that a temperature of the assembled body is within 0&#xb0; C. to 150&#xb0; C. In the bonding step, a metal particle paste minimally generates a sintering reaction.

Method of manufacturing bonded body

Provided is a bonding device for bonding a substrate and an electronic part of an assembled body which is formed by mounting the electronic part on the substrate with a metal particle paste sandwiched therebetween. The bonding device is configured to bond the substrate and the electronic part to each other by heating a pressure applying unit having a first transfer member and a second transfer member which transfer pressure and heat to the assembled body n a state where the assembled body is sandwiched between the first transfer member and the second transfer member while applying pressure to the pressure applying unit. The bonding device further includes a heating mechanism part having a first heating part and a second heating part arranged at positions opposite to each other, a positioning mechanism part, and a pressure applying mechanism part.

Bonding device, bonding method and pressure applying unit

Provided is a pressure applying unit used in baking a metal particle paste of an assembled body formed by arranging an electronic part on a substrate with the metal particle paste interposed therebetween by heating the assembled body while applying pressure to the assembled body using a pair of heating parts. The pressure applying unit includes: a pair of transferring members which transfers pressure and heat to the assembled body by sandwiching the assembled body therebetween; guide members which movably connect the pair of transferring members to each other; and a distance adjusting mechanism being configured to make the second transferring member separated from the assembled body during a pressure non-applying time and brings both the first transferring member and the second transferring member into contact with the assembled body during a pressure applying time.

Pressure applying unit

The present invention addresses the problem of providing a composite nanometal paste which is relatively low in price and is excellent in terms of bonding characteristics, thermal conductivity, and electrical property. The present invention is a copper-filler-containing composite nanometal paste that contains composite nanometal particles each comprising a metal core and an organic coating layer formed thereon. The metal paste contains a copper filler and contains, as binders, first composite nanometal particles and second composite nanometal particles which differ from the first composite nanometal particles in the thermal decomposition temperature of the organic coating layer, wherein the mass proportion Wof the organic coating layer in the first composite nanometal particles is in the range of 2-13 mass %, the mass proportion Wof the organic coating layer in the second composite nanometal particles is in the range of 5-25 mass %, and these particles satisfy the relationships W

Composite nanometal paste containing copper filler and joining method

Provided is a composite nanometal paste, whose layer, when sintered in an inert gas under no load, gives a metal layer that is equal or superior in electrical conductivity and thermal conductivity to conventional lead-rich solders. The composite nanometal paste contains, as metal components, composite metal nanoparticles comprising metal cores with an average particle diameter of d (nm) and an organic coating layer formed around the circumference, and metal filler particles having an average particle diameter of D (nm), and satisfies the first relation d&#x3c;D and the second relation d&#x3c;100 (nm). When said organic coating layer volatilizes so that a metal layer is formed by sintering, the size relation between said average particle diameters d, D is designed so that said composite metal nanoparticle can be embedded in a hollow four pocket formed when it is assumed that four said metal filler particles are placed so that they come in contact with a tetrahedron, and it has a property in which said composite metal nanoparticles and said metal filler particles sinter compactly.

Growing community of inventors

Saitama, Japan

Ryo Matsubayashi