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For the Inventor, By the Inventor

Carlsbad, CA, United States of America

Ryan Michael Coutts

USPTO Granted Patents = 16 

 

Average Co-Inventor Count = 2.2

ph-index = 4

Forward Citations = 32(Granted Patents)


Company Filing History:

goldMedal16 out of 41,498 
 
Qualcomm Incorporated
 patents

Years Active: 2016-2019

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16 patents (USPTO):Explore Patents
1. 10401235 - Thermal sensor placement for hotspot interpolation (2019-09-03),
2. 10188015 - Hybrid design of heat spreader and temperature sensor for direct handheld device skin temperature measurement (2019-01-22),
3. 10061331 - Systems and methods for detecting thermal runaway (2018-08-28),
4. 10048316 - Estimating timing slack with an endpoint criticality sensor circuit (2018-08-14),
5. 9943008 - Thermal modulation of an electronic device (2018-04-10),
6. 9871506 - Switchable decoupling capacitors (2018-01-16),
7. 9829941 - Mobile device with backside capacitive sensor for thermal management of an exterior housing (2017-11-28),
8. 9651969 - Adaptive voltage scaling using analytical models for interconnect delay (2017-05-16),
9. 9638743 - State-dependent capacitance estimation (2017-05-02),
10. 9618957 - Switchable package capacitor for charge conservation and series resistance (2017-04-11),
11. 9585242 - Plane connected embedded substrate capacitor (2017-02-28),
12. 9582027 - Clock swallowing device for reducing voltage noise (2017-02-28),
13. 9496851 - Systems and methods for setting logic to a desired leakage state (2016-11-15),
14. 9429610 - Voltage dependent die RC modeling for system level power distribution networks (2016-08-30),
15. 9377804 - Switchable package capacitor for charge conservation and series resistance (2016-06-28),

Title: Ryan Michael Coutts: Innovator in Thermal Management Technologies

Introduction

Ryan Michael Coutts is a prominent inventor based in Carlsbad, CA (US). He has made significant contributions to the field of thermal management, holding a total of 16 patents. His work primarily focuses on innovative solutions for temperature measurement and management in electronic devices.

Latest Patents

Among his latest patents is the invention titled "Thermal sensor placement for hotspot interpolation." This patent describes a temperature management system that utilizes multiple thermal sensors located at various points on a chip. The system includes a temperature manager that receives readings from these sensors, fits a quadratic temperature model to the data, and estimates hotspot temperatures on the chip. Another notable patent is "Hybrid design of heat spreader and temperature sensor for direct handheld device skin temperature measurement." This invention outlines a hybrid design that allows for the reduction of external skin temperature on handheld devices while enabling direct measurement of that temperature. The heat spreader is thermally coupled to the device's surface and features regions that produce electrical resistance when current is applied, allowing for accurate temperature correlation.

Career Highlights

Ryan Coutts is currently employed at Qualcomm Incorporated, a leading company in the telecommunications and semiconductor industry. His work at Qualcomm has allowed him to develop and refine his innovative ideas in thermal management technologies.

Collaborations

Ryan has collaborated with notable colleagues such as Rajat Mittal and Mehdi Saeidi, contributing to advancements in their respective fields.

Conclusion

Ryan Michael Coutts is a distinguished inventor whose work in thermal management technologies has led to significant advancements in the industry. His innovative patents reflect his commitment to improving temperature measurement and management in electronic devices.

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