The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 14, 2018

Filed:

Apr. 20, 2017
Applicant:

Qualcomm Incorporated, San Diego, CA (US);

Inventors:

Ryan Michael Coutts, Carlsbad, CA (US);

Samy Shafik Tawfik Zaynoun, San Diego, CA (US);

Paul Ivan Penzes, San Diego, CA (US);

Assignee:

QUALCOMM Incorporated, San Diego, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01R 31/28 (2006.01); G01R 31/317 (2006.01); G06F 1/10 (2006.01); G06F 1/08 (2006.01);
U.S. Cl.
CPC ...
G01R 31/31725 (2013.01); G06F 1/08 (2013.01); G06F 1/10 (2013.01);
Abstract

Various aspects of this disclosure describe measuring timing slack using an endpoint criticality sensor on a chip. A sensor circuit is attached to sensitive endpoints on the chip (e.g., logical gates in a timing critical path) so that the sensor circuit receives the endpoint's data signal and clock signal. The sensor circuit introduces skew between the data signal and the clock signal by delaying the data signal more than the clock signal, and compares skewed data signals to determine if an error occurs because of the induced skew. By delaying the data signal with different delay amounts and monitoring what delays cause errors, an amount of timing slack in the data signal and clock signal (e.g., margin to criticality) is measured during operation of the chip for relevant circuitry to the system implemented on the chip, compared to test circuitry operating while the chip is in a test mode.


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