The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 28, 2017
Filed:
Feb. 20, 2014
Applicant:
Qualcomm Incorporated, San Diego, CA (US);
Inventors:
Ryan Michael Coutts, Carlsbad, CA (US);
Yuancheng Christopher Pan, Saratoga, CA (US);
Assignee:
QUALCOMM Incorporated, San Diego, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); H05K 1/18 (2006.01); H01L 23/498 (2006.01); H05K 3/46 (2006.01); H01L 23/64 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0231 (2013.01); H01L 23/49822 (2013.01); H05K 1/185 (2013.01); H01L 23/642 (2013.01); H01L 24/13 (2013.01); H01L 24/16 (2013.01); H01L 2224/131 (2013.01); H01L 2224/13147 (2013.01); H01L 2224/16227 (2013.01); H01L 2924/15311 (2013.01); H05K 3/4697 (2013.01); H05K 2201/093 (2013.01); H05K 2201/10015 (2013.01);
Abstract
A package substrate is provided that includes a substrate and a capacitor. The substrate comprises a cavity penetrating a core layer and metal layers of the substrate. The capacitor comprises electrode pads and is disposed in the cavity. One of the metal layers of the substrate includes a discontinuous metal plane, and the electrode pads directly contact the discontinuous metal plane.