Ruiping Wang

Title: The Innovative Contributions of Ruiping Wang

Introduction: Ruiping Wang, based in Fremont, CA, is a notable inventor with a remarkable portfolio of 21 patents. His innovations primarily focus on enhancing the efficiency and effectiveness of substrate processing tools, significantly impacting the domain of hybrid bonding technologies.

Latest Patents: Wang's latest patents showcase his expertise in developing advanced techniques within the semiconductor industry. One notable patent is related to the "On-board cleaning of tooling parts in a hybrid bonding tool." This invention outlines methods and apparatus for cleaning tooling parts in a substrate processing tool. The process involves a systematic approach where dirty tools are placed in a holder within a bonding chamber, transferred to a cleaning chamber for thorough cleaning, inspected in an inspection chamber, and eventually returned to the bonding chamber as cleaned tools.

Another significant patent is titled "Apparatus for environmental control of dies and substrates for hybrid bonding." This invention aims to extend substrate queue time for hybrid bonding by maintaining plasma activation. It incorporates an environmentally controllable space with a support structure for holding a die or substrate, a gas velocity accelerator for lateral gas recirculation, a humidifier for adjustable humidity levels, and a relative humidity sensor to ensure optimal conditions.

Career Highlights: Throughout his career, Ruiping Wang has made significant strides in semiconductor processing technology. He has been associated with renowned companies like Applied Materials, Inc., where he contributed to the development of innovative solutions in the field. His extensive experience and technical skills have earned him recognition in both academic and industrial domains.

Collaborations: Ruiping Wang has collaborated with various professionals in the industry, including esteemed colleagues Gerald Z Yin and Joseph P Caulfield. These collaborations have facilitated the exchange of ideas and further advanced the technology in substrate processing and hybrid bonding.

Conclusion: Ruiping Wang stands as a leading inventor within the realm of substrate processing technologies. With 21 patents to his name, his innovative methods and apparatuses continue to shape the future of hybrid bonding tools, enhancing operational efficiency and technology reliability. His contributions are invaluable, paving the way for further advancements in the semiconductor industry.