The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 25, 2025

Filed:

Sep. 15, 2022
Applicant:

Applied Materials, Inc., Santa Clara, CA (US);

Inventors:

Ruiping Wang, San Jose, CA (US);

Ying Wang, Singapore, SG;

Guan Huei See, Singapore, SG;

Ananthkrishna Jupudi, Singapore, SG;

Praveen Kumar Choragudi, Singapore, SG;

Assignee:

APPLIED MATERIALS, INC., Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/67 (2006.01); B08B 1/10 (2024.01); B08B 3/04 (2006.01); B08B 7/00 (2006.01); B08B 13/00 (2006.01); F26B 25/14 (2006.01); G06T 1/00 (2006.01); H01L 21/683 (2006.01);
U.S. Cl.
CPC ...
H01L 21/67207 (2013.01); B08B 1/10 (2024.01); B08B 3/04 (2013.01); B08B 7/0035 (2013.01); B08B 13/00 (2013.01); F26B 25/14 (2013.01); G06T 1/0014 (2013.01); H01L 21/67144 (2013.01); H01L 21/6838 (2013.01);
Abstract

Methods and apparatus for cleaning tooling parts in a substrate processing tool are provided herein. In some embodiments, a method of cleaning tooling parts in a substrate processing tool includes placing one or more dirty tools on a holder in a bonding chamber of a multi-chamber processing tool; transferring the holder from the bonding chamber to a cleaning chamber of the multi-chamber processing tool; cleaning the one or more dirty tools in the cleaning chamber to produce one or more cleaned tools; inspecting the one or more cleaned tools in an inspection chamber of the multi-chamber processing tool; and transferring the one or more cleaned tools to the bonding chamber.


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