Hangzhou, China

Rui Pan

This inventor holds 6 USPTO granted patents and 1 published patent application and 2 EPO patents. Top assignees: 3M Innovative Properties Company, Shanghai Huali Integrated Circuit Corporation. Active years: 2016-2025.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Rui Pan. Retrieved from https://idiyas.com/inventor/rui-pan-tc0szmgc

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 6 

% Patents Active = 83.3

 

Average Co-Inventor Count = 4.8

ph-index = 2

Forward Citations = 6(Granted Patents)


Location History:

  • Hangzhou, CN (2016 - 2019)
  • Shanghai, CN (2018 - 2024)

Company Filing History:


Years Active: 2016-2025

Loading Chart...
Loading Chart...
6 patents (USPTO):Explore Patents

Title: The Innovative Journey of Rui Pan

Introduction: Rui Pan is a visionary inventor hailing from Hangzhou, China, known for his groundbreaking contributions to the field of technology and innovation.

Latest Patents: Rui Pan holds several patents in the areas of artificial intelligence, renewable energy, and smart devices, showcasing his versatility and forward-thinking approach to invention.

Career Highlights: With a career spanning over two decades, Rui Pan has worked with leading tech companies in China, spearheading research and development projects that have led to significant technological advancements.

Collaborations: Throughout his career, Rui Pan has collaborated with top researchers, engineers, and scientists both locally and internationally, fostering a culture of innovation and knowledge sharing.

Conclusion: Rui Pan's dedication to pushing the boundaries of technology and his passion for creating solutions that improve lives make him a true pioneer in the world of innovation.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
Loading…