This inventor holds 10 USPTO granted patents and 1 published patent application. Top assignee: Taiwan Semiconductor Manufacturing Comp. Ltd.. Active years: 2013-2024.
Company Filing History:
Years Active: 2013-2024
Title: Innovations of Ru-Ying Huang
Introduction
Ru-Ying Huang is a prominent inventor based in Taipei, Taiwan. He has made significant contributions to the field of semiconductor technology, holding a total of 10 patents. His work focuses on enhancing the bondability and strength of integrated chip structures.
Latest Patents
One of Ru-Ying Huang's latest patents is titled "Pad structure for enhanced bondability." This patent describes various embodiments directed towards a pad with high strength and bondability. In some embodiments, an integrated chip comprises a substrate, an interconnect structure, a pad, and a conductive structure. The interconnect structure adjoins the substrate and comprises wires and vias. The wires and the vias are stacked between the pad and the substrate. The conductive structure, such as a wire bond, extends through the substrate to the pad. By arranging the wires and the vias between the pad and the substrate, the pad may be inset into a passivation layer of the interconnect structure, allowing the passivation layer to absorb stress on the pad. Furthermore, the pad may contact the wires and the vias at a top wire level, where the thickness of the top wire level may exceed that of other wire levels, making it more tolerant to stress.
Career Highlights
Ru-Ying Huang is currently employed at Taiwan Semiconductor Manufacturing Company Limited, a leading firm in the semiconductor industry. His innovative work has contributed to advancements in chip design and manufacturing processes.
Collaborations
He has collaborated with notable coworkers, including Yian-Liang Kuo and Tsung-Fu Tsai, who have also made significant contributions to the field.
Conclusion
Ru-Ying Huang's innovative patents and contributions to semiconductor technology highlight his expertise and dedication to advancing the industry. His work continues to influence the development of more efficient and reliable integrated circuits.