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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 8847387 B1

PDFFull Text
Date of Patent:
Sep. 30, 2014

Filed:

Jul. 23, 2010

Robust joint structure for flip-chip bonding

Applicants:

Ching-wen Hsiao, Banqiao, TW;

Yao-chun Chuang, Taipei, TW;

Chen-shien Chen, Zhubei, TW;

Chen-cheng Kuo, Chu-Pei, TW;

Ru-ying Huang, Taipei, TW;

Inventors:

Ching-Wen Hsiao, Banqiao, TW;

Yao-Chun Chuang, Taipei, TW;

Chen-Shien Chen, Zhubei, TW;

Chen-Cheng Kuo, Chu-Pei, TW;

Ru-Ying Huang, Taipei, TW;

Assignee:

Taiwan Semiconductor Manufacturing Company, Ltd., Hsin-Chu, TW;

Attorney:

Slater & Matsil, L.L.P.

Primary Examiner:

David Vu

Assistant Examiner:

Brandon Fox

Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 23/00 (2006.01); H01L 23/498 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49827 (2013.01); H01L 2224/16145 (2013.01); H01L 2924/01322 (2013.01); H01L 2224/05075 (2013.01); H01L 2924/01006 (2013.01); H01L 2224/16238 (2013.01); H01L 24/11 (2013.01); H01L 24/13 (2013.01); H01L 24/16 (2013.01); H01L 2224/05184 (2013.01); H01L 2224/13022 (2013.01); H01L 24/81 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/05139 (2013.01); H01L 2924/01082 (2013.01); H01L 2224/81203 (2013.01); H01L 2224/13655 (2013.01); H01L 2224/13582 (2013.01); H01L 2224/05572 (2013.01); H01L 2224/81193 (2013.01); H01L 2924/01074 (2013.01); H01L 2224/13116 (2013.01); H01L 2224/13083 (2013.01); H01L 23/49816 (2013.01); H01L 2224/1146 (2013.01); H01L 2224/16148 (2013.01); H01L 2924/01047 (2013.01); H01L 2224/05022 (2013.01); H01L 2224/13111 (2013.01); H01L 2224/05655 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/05144 (2013.01); H01L 2224/13155 (2013.01); H01L 2224/1147 (2013.01); H01L 2924/01029 (2013.01); H01L 2924/01019 (2013.01); H01L 2224/05647 (2013.01); H01L 2224/131 (2013.01); H01L 2924/014 (2013.01); H01L 2924/01033 (2013.01); H01L 2224/05666 (2013.01); H01L 2224/13147 (2013.01); H01L 2224/05147 (2013.01); H01L 2224/13562 (2013.01); H01L 2924/01079 (2013.01); H01L 2224/05073 (2013.01); H01L 2224/05571 (2013.01); H01L 2924/01023 (2013.01); H01L 2224/13644 (2013.01); H01L 2224/05582 (2013.01); H01L 2224/13144 (2013.01); H01L 2224/81815 (2013.01); H01L 2924/01013 (2013.01); H01L 2224/05155 (2013.01);
Abstract

An integrated circuit structure includes a first work piece and a second work piece. The first work piece includes a copper bump at a main surface of the first work piece and having a first dimension; and a nickel-containing barrier layer over and adjoining the copper bump. The second work piece is bonded to the first work piece and includes a bond pad at a main surface of the second work piece; and a solder mask at the main surface of the second work piece and having a solder resist opening with a second dimension exposing a portion of the bond pad. A ratio of the first dimension to the second dimension is greater than about 1. Further, a solder region electrically connects the copper bump to the bond pad, with a vertical distance between the bond pad and the copper bump being greater than about 30 μm.

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