Corvallis, OR, United States of America

Ronald L Enck



Average Co-Inventor Count = 4.4

ph-index = 6

Forward Citations = 137(Granted Patents)


Company Filing History:


Years Active: 2001-2009

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18 patents (USPTO):Explore Patents

Title: The Innovative Contributions of Ronald L. Enck

Introduction

Ronald L. Enck is a notable inventor based in Corvallis, OR (US), recognized for his significant contributions to technology and engineering. With a total of 18 patents to his name, Enck has made a lasting impact in his field through innovative designs and solutions.

Latest Patents

Among his latest patents is a vacuum device featuring a non-evaporable getter component with increased exposed surface area. This vacuum device includes a substrate and a support structure, where the support structure is positioned over the substrate. The non-evaporable getter layer is designed to extend beyond the support perimeter, creating a vacuum gap that enhances the exposed surface area. Another notable patent involves ink-jet printhead fabrication, utilizing a silicon wafer substrate. This process improves the fabrication by allowing the simultaneous formation of MOSFET source/drain contact vias along with substrate contact vias, employing a dry etch with a silicon oxide:silicon etch rate of at least 10:1.

Career Highlights

Throughout his career, Ronald L. Enck has worked with prominent companies, including Hewlett-Packard Development Company, L.P. and Hewlett-Packard Company. His work has contributed to advancements in various technologies, particularly in the fields of vacuum devices and printhead fabrication.

Collaborations

Enck has collaborated with talented individuals such as Zhizhang Chen and Sriram Ramamoorthi, further enhancing the innovative projects he has been involved in.

Conclusion

Ronald L. Enck's contributions to technology through his patents and collaborations highlight his role as a significant inventor in the industry. His work continues to influence advancements in engineering and technology.

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