The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 28, 2005
Filed:
Jan. 31, 2002
Michael D. Miller, Pnilomath, OR (US);
Michael Hager, Corvalis, OR (US);
Naoto A. Kawamura, Corvallis, OR (US);
Roberto A. Pugliese, Jr., Tangent, OR (US);
Ronald L. Enck, Corvallis, OR (US);
Susanne L. Kumpf, Corvallis, OR (US);
Shen Buswell, Monmouth, OR (US);
Mehrgan Khavari, Corvallis, OR (US);
Michael D. Miller, Pnilomath, OR (US);
Michael Hager, Corvalis, OR (US);
Naoto A. Kawamura, Corvallis, OR (US);
Roberto A. Pugliese, Jr., Tangent, OR (US);
Ronald L. Enck, Corvallis, OR (US);
Susanne L. Kumpf, Corvallis, OR (US);
Shen Buswell, Monmouth, OR (US);
Mehrgan Khavari, Corvallis, OR (US);
Hewlett-Packard Development Company, L.P., Houston, TX (US);
Abstract
The described embodiments relate to methods and systems for forming slots in a substrate. In one exemplary embodiment, a slot is formed in a substrate that has first and second opposing surfaces. A first trench is dry etched through the first surface of the substrate. A second trench is created through the second surface of the substrate effective to form, in combination with the first trench, a slot. At least a portion of the slot passes entirely through the substrate, and the maximum width of the slot is less than or equal to about 50 of the thickness of the substrate.