Company Filing History:
Years Active: 2003-2013
Title: Innovations of Romeo Emmanuel P Alvarez
Introduction
Romeo Emmanuel P Alvarez is a notable inventor based in Singapore, known for his contributions to integrated circuit technology. With a total of seven patents to his name, he has made significant advancements in the field of electronics and semiconductor packaging.
Latest Patents
One of his latest patents is an integrated circuit system featuring different-size solder bumps and different-size bonding pads. This innovative solder bumping system includes a substrate with a redistribution layer, an insulation layer with multiple openings, and a series of UBM (Under Bump Metallization) layers made from titanium, chromium/copper alloy, and copper. The design allows for the formation of UBM pads of varying sizes, enabling the printing of solder paste that is reflowed to create both smaller and larger solder bumps. Another significant patent is an integrated circuit package system that incorporates a patterned redistribution pad over the integrated circuit, enhancing the efficiency and reliability of electronic devices.
Career Highlights
Throughout his career, Romeo has worked with prominent companies such as Stats Chippac Pte. Ltd. and Advanpack Solutions Pte Ltd. His expertise in integrated circuit technology has positioned him as a key player in the semiconductor industry.
Collaborations
Romeo has collaborated with talented professionals in his field, including Yaojian Lin and Byung Tai Do. These partnerships have contributed to the development of innovative solutions in integrated circuit design and manufacturing.
Conclusion
Romeo Emmanuel P Alvarez's work in integrated circuit technology showcases his inventive spirit and dedication to advancing the electronics industry. His patents reflect a commitment to innovation that continues to influence the field.