The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 11, 2004
Filed:
Dec. 10, 2002
Applicant:
Inventor:
Romeo Emmanuel P. Alvarez, Singapore, SG;
Assignee:
Advanpack Solutions Pte Ltd., Singapore, SG;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B23K 3/514 ;
U.S. Cl.
CPC ...
B23K 3/514 ;
Abstract
A method for fabricating a chip scale package is described. The method utilizes wafer level processes to obtain a chip level package. The method particularly avoids the use of mechanical grinding by the novel use of molding, extruding, and etching technology.