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For the Inventor, By the Inventor

Jericho, VT, United States of America

Rock Nadeau

This inventor holds 10 USPTO granted patents. Top assignee: International Business Machines Corporation. Active years: 1997-2003.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Rock Nadeau. Retrieved from https://idiyas.com/inventor/rock-nadeau

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 10

% Patents Active = 80.0

Average Co-Inventor Count = 6.2

ph-index = 8

Forward Citations = 164(Granted Patents)


Location History:

  • Essex Junction, VT (US) (1997 - 1999)
  • Jericho, VT (US) (1999 - 2002)
  • Chittenden, VT (US) (2003)

Company Filing History:

goldMedal10 out of 166,325 
 
International Business Machines Corporation
 patents

Years Active: 1997-2003

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10 patents (USPTO):Explore Patents
1. 6579149 - Support and alignment device for enabling chemical mechanical polishing rinse and film measurements (2003-06-17),
2. 6458020 - Slurry recirculation in chemical mechanical polishing (2002-10-01),
3. 6340601 - Method for reworking copper metallurgy in semiconductor devices (2002-01-22),
4. 6334807 - Chemical mechanical polishing in-situ end point system (2002-01-01),
5. 6319093 - Chemical-mechanical polishing system and method for integrated spin dry-film thickness measurement (2001-11-20),
6. 6022266 - In-situ pad conditioning process for CMP (2000-02-08),
7. 5885135 - CMP wafer carrier for preferential polishing of a wafer (1999-03-23),
8. 5874318 - Dishing and erosion monitor structure for damascene metal processing (1999-02-23),
9. 5723874 - Dishing and erosion monitor structure for damascene metal processing (1998-03-03),
10. 5663637 - Rotary signal coupling for chemical mechanical polishing endpoint (1997-09-02),

Title: Rock Nadeau: A Pioneer in Inventions Shaping Technology

Introduction:

Rock Nadeau, based in Jericho, VT (US), is a maverick inventor whose passion for innovation and relentless pursuit of excellence have established him as a true pioneer in the world of inventions. With 10 patents to his name and a promising future ahead, Nadeau is actively shaping the landscape of technology.

Latest Patents:

1. Support and Alignment Device for Enabling Chemical Mechanical Polishing Rinse and Film Measurements: Nadeau's latest invention revolutionizes precision alignment and support for an optical film measurement probe in the wafer rinse tank of a CMP polish tool. The device's innovative design ensures accurate measurements while enabling smooth rotation and motion of the wafer and chuck.

2. Slurry Recirculation in Chemical Mechanical Polishing: Nadeau's recirculation mechanism redirects slurry towards the center of a platen during chemical-mechanical polishing, enhancing efficiency by recycling slurry that would otherwise be lost due to centrifugal force.

Career Highlights:

Rock Nadeau is currently making waves in the innovation sector as a key member of the International Business Machines Corporation (IBM). His contributions at IBM have significantly impacted the field of technology and established him as a leading figure in the industry.

Collaborations:

Nadeau's exceptional work ethic and groundbreaking inventions have garnered the respect of his peers, including notable coworkers such as Paul H Smith, Jr, and Richard John Lebel. Through collaborative efforts, Nadeau continues to push the boundaries of innovation and inspire those around him.

Conclusion:

In conclusion, Rock Nadeau's innovative spirit, coupled with his remarkable talent for invention, positions him as a driving force in the realm of technological advancements. With a string of successful patents and a bright future ahead, Nadeau's contributions are sure to leave an indelible mark on the world of inventions.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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