The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 20, 2001
Filed:
Feb. 06, 2001
Richard J. Lebel, Williston, VT (US);
Frederic Maurer, Valhalla, NY (US);
Rock Nadeau, Jericho, VT (US);
Paul H. Smith, Jr., Essex Junction, VT (US);
Hemantha K. Wickramasinghe, Chappaqua, NY (US);
Theodore G. van Kessel, Millbrook, NY (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
A system and method that integrates film thickness measurements with a chemical-mechanical polishing (CMP) spin-dry tool. By doing so, each wafer can be measured as it comes out of the previous CMP process. Thickness measurement feedback is provided, which controls processing of the wafer and also monitor operational status of a CMP polishing unit prior to completion of the wafer being polished, resulting in significant cost and cycle time reduction through the elimination of tool infrastructure and wafer handling by assuring proper tolerances of the CMP polishing unit are maintained.