Nerviano, Italy

Roberto Tiziani

This inventor holds 19 USPTO granted patents and 11 published patent applications and 6 EPO patents, primarily in Semiconductor Manufacturing. Top assignees: Stmicroelectronics S.r.l., Shenzhen Sts Microelectronics Co., Ltd., Stmicroelectronics (Rousset) Sas. Active years: 2001-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Roberto Tiziani. Retrieved from https://idiyas.com/inventor/roberto-tiziani

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 19 

% Patents Active = 94.7

 

Average Co-Inventor Count = 2.2

ph-index = 4

Forward Citations = 41(Granted Patents)


Location History:

  • Milan, IT (2002 - 2008)
  • Nerviano, IT (2001 - 2024)

Company Filing History:


Years Active: 2001-2026

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Areas of Expertise:
Semiconductor Devices
Electronic Module
LIDAR Applications
Packaging
Die Pad
Leadframe
Power Semiconductor
Thermal Management
Integrated Circuits
Plastic Packages
Molded MMC
Flip-Chip Connections
19 patents (USPTO):Explore Patents

Title: The Innovative Journey of Roberto Tiziani

Introduction

Roberto Tiziani, an accomplished inventor based in Nerviano, Italy, has made significant contributions to the field of semiconductor technology. With a total of 13 patents to his name, his work exemplifies a deep understanding of both innovation and practical application in electronics.

Latest Patents

Among Tiziani's latest patents is a groundbreaking innovation titled "Semiconductor device with die mounted to an insulating substrate and corresponding method of manufacturing semiconductor devices." This invention describes a packaged semiconductor device featuring a substrate with a first surface and a second opposite surface. At least one semiconductor die is mounted on the first surface, while electrically-conductive leads are arranged around the substrate. The design emphasizes the connection between the semiconductor die and designated leads through electrically-conductive formations, ensuring functionality and reliability. Furthermore, the package molding material is skillfully molded onto the semiconductor die and leads, leaving the second surface of the substrate uncovered. Another recent patent encompasses a semiconductor device comprising at least one semiconductor die electrically coupled to a set of leads, with the inventive focus on exposed electrically conductive pads for easy coupling to printed circuit boards.

Career Highlights

Roberto Tiziani's career is characterized by his tenure at leading companies, particularly Stmicroelectronics S.r.l., where he applied his innovative mindset and expertise in semiconductor devices. His contributions have driven advancements in semiconductor technology, paving the way for new applications and solutions in electronics.

Collaborations

Throughout his career, Tiziani has collaborated with esteemed colleagues, including Giovanni Frezza and Carlo Alberto Passagrilli. These partnerships have fostered a rich exchange of ideas and a collaborative spirit that underscores the importance of teamwork in driving innovation.

Conclusion

Roberto Tiziani's journey as an inventor is marked by innovation, collaboration, and a commitment to advancing semiconductor technology. With a portfolio of 13 patents, his impact on the industry is undeniable, and his work continues to influence future developments in electronic devices.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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