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For the Inventor, By the Inventor

Shenzhen, China

Shenzhen Sts Microelectronics Co., Ltd.


USPTO Granted Patents = 1


Forward Citations = 0

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9 inventors (with patents filed for the assignee):

goldMedal Qian Liu (1 out of 4 patents)

silverMedal Roberto Tiziani (1 out of 19 patents)

bronzeMedal Feng Ding (1 out of 8 patents)

4.  Yi Ming Liang (1 out of 1 patent)

5.  Lin Liang (5 patents)

6.  Qiao Chen (1 patent)

7.  Nan Nan Zheng (0 patent)

8.  Nan Nan Zheng (0 patent)

9.  Zhi Chang Zhang (0 patent)


1 patent:

1. 12557647 - Semiconductor package, method of forming the package and electronic device (2026-02-17),
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USPTO Data Jan 1 1976 - Sep 15 2026

1 Patents

#3,206 in Shenzhen

#18,478 in China

Shenzhen, CN
Shenzhen, China

Shenzhen Sts Microelectronics Co., Ltd.

Forward Citations = 0

9 inventors:

goldMedal Qian Liu (1 out of 4 patents)

silverMedal Roberto Tiziani (1 out of 19 patents)

bronzeMedal Feng Ding (1 out of 8 patents)

4.  Yi Ming Liang (1 out of 1 patent)

5.  Lin Liang (5 patents)

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