IDiyas

For the Inventor, By the Inventor

Burlington, VT, United States of America

Robert Michael Geffken

USPTO Granted Patents = 44


Average Co-Inventor Count = 3.0

ph-index = 18

Forward Citations = 1,355(Granted Patents)


Company Filing History:

goldMedal40 out of 164,108 
 
International Business Machines Corporation
 patents
silverMedal4 out of 84 
 
Tel Epion Corporation
 patents

Years Active: 1978-2010

where 'Filed Patents' based on already Granted Patents

44 patents (USPTO):
1. 7838423 - Method of forming capping structures on one or more material layer surfaces (2010-11-23),
2. 7799683 - Copper interconnect wiring and method and apparatus for forming thereof (2010-09-21),
3. 7759251 - Dual damascene integration structure and method for forming improved dual damascene integration structure (2010-07-20),
4. 7655547 - Metal spacer in single and dual damascene processing (2010-02-02),
5. 7393777 - Sacrificial metal spacer damascene process (2008-07-01),
6. 7381637 - Metal spacer in single and dual damascence processing (2008-06-03),
7. 7358148 - Adjustable self-aligned air gap dielectric for low capacitance wiring (2008-04-15),
8. 7291558 - Copper interconnect wiring and method of forming thereof (2007-11-06),
9. 7071532 - Adjustable self-aligned air gap dielectric for low capacitance wiring (2006-07-04),
10. 6982227 - Single and multilevel rework (2006-01-03),
11. 6939791 - Contact capping local interconnect (2005-09-06),
12. 6888251 - Metal spacer in single and dual damascene processing (2005-05-03),
13. 6846741 - Sacrificial metal spacer damascene process (2005-01-25),
14. 6746947 - Post-fuse blow corrosion prevention structure for copper fuses (2004-06-08),
15. 6680514 - Contact capping local interconnect (2004-01-20),

Title: The Innovator Extraordinaire: Robert Michael Geffken

Introduction:

Robert Michael Geffken, a pioneering inventor based in Burlington, VT, has left an indelible mark on the world of patents with his remarkable innovations and contributions. With an impressive portfolio of 44 patents, his work exemplifies a relentless pursuit of innovation and excellence.

Latest Patents:

Geffken's latest patents showcase his expertise in cutting-edge technologies. One patent involves the method of forming capping structures on different material layer surfaces, utilizing a gas-cluster ion-beam process to create capping structures on semiconductor surfaces. Another patent focuses on copper interconnect wiring, addressing issues of reduced copper diffusion and improved electromigration lifetime through innovative techniques.

Career Highlights:

Having worked at esteemed companies like IBM (International Business Machines Corporation) and Tel Epion Corporation, Geffken has been at the forefront of technological advancements in the industry. His roles at these companies have allowed him to spearhead groundbreaking projects and contribute significantly to the field of semiconductor technology.

Collaborations:

Throughout his career, Geffken has collaborated with accomplished individuals such as Anthony K Stamper and William Thomas Motsiff. These collaborations have led to synergistic efforts in research and development, resulting in the creation of innovative solutions that have pushed the boundaries of technological advancement.

Conclusion:

In conclusion, Robert Michael Geffken stands as a shining example of an inventor whose relentless pursuit of innovation has made a significant impact in the world of patents. His work continues to inspire and pave the way for future inventors to follow in his footsteps, leaving a lasting legacy in the realm of technological innovation and advancement.

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