Robert J Contolini

Title: Robert J Contolini: A Pioneering Inventor in Electroplating Technologies

Introduction

Robert J Contolini, based in Lake Oswego, Oregon, is a prominent inventor known for his significant contributions to the field of electroplating technologies. With an impressive portfolio of 31 patents, Contolini has made vital advancements that enhance the performance and efficiency of semiconductor manufacturing processes.

Latest Patents

Among his latest innovations, Contolini has developed a groundbreaking method and apparatus for potential controlled electroplating of fine patterns on semiconductor wafers. This controlled-potential electroplating technique effectively addresses the challenge of depositing metals onto high aspect ratio recessed features of integrated circuit devices. His methods aim to mitigate corrosion of the metal seed layer, ensuring optimal performance in integrated circuits. Furthermore, his apparatus incorporates a reference electrode placed near the surface to be plated along with cathode sense leads for precise potential measurement at various points.

In addition, Contolini has created a dynamically variable field shaping element utilized in electrochemical reactors for electrochemical treatment of substrates. This advanced system offers unparalleled flexibility by varying the surface area of the field-shaping shield and its orientation during processing. This innovation compensates for potential drop along the wafer's radius, ultimately establishing an inverse potential drop in the electrolytic fluid and countering resistance caused by the thin metal film on wafers.

Career Highlights

Throughout his illustrious career, Robert J Contolini has worked with notable organizations such as Novellus Systems Incorporated and the University of California. His experience in these esteemed institutions has contributed significantly to his research and development efforts in the field of electroplating.

Collaborations

Contolini has collaborated with several accomplished professionals in the industry, including Jonathan David Reid and Evan E Patton. These partnerships have facilitated the exchange of ideas and expertise, further driving innovation in their collective endeavors.

Conclusion

Robert J Contolini remains at the forefront of technological advancements in electroplating and semiconductor manufacturing. His extensive patent portfolio highlights his innovative spirit and commitment to enhancing manufacturing processes, paving the way for future advancements in the field.