Robert Hoelzl

Title: Innovations of Robert Hoelzl in Semiconductor Technology

Introduction

Robert Hoelzl is a notable inventor based in Postmuenster, Germany. He has made significant contributions to the field of semiconductor technology, holding a total of three patents. His work focuses on improving the quality and production processes of semiconductor wafers.

Latest Patents

Hoelzl's latest patents include a layered semiconductor wafer with low warp and bow, and a process for producing it. This innovation involves semiconductor wafers with a diameter of at least 200 mm, which comprise a silicon carrier wafer, an electrically insulating layer, and a semiconductor layer. The production process utilizes a layer transfer method that includes at least one rapid thermal annealing (RTA) step. The resulting semiconductor wafer exhibits a warp of less than 30 µm, a DeltaWarp of less than 30 µm, a bow of less than 10 µm, and a DeltaBow of less than 10 µm. Additionally, he has developed a process for producing a single-crystal silicon wafer, which involves specific heat treatment regimens and exposure to an oxygen-containing atmosphere.

Career Highlights

Robert Hoelzl is currently associated with Siltronic AG, a leading company in the semiconductor industry. His work has been instrumental in advancing the production techniques and quality of silicon wafers, which are critical components in various electronic devices.

Collaborations

Hoelzl has collaborated with notable colleagues, including Reinhold Wahlich and Andreas Huber, to further enhance the innovations in semiconductor technology.

Conclusion

Robert Hoelzl's contributions to semiconductor technology through his patents and collaborations have significantly impacted the industry. His work continues to pave the way for advancements in the production and quality of semiconductor wafers.