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For the Inventor, By the Inventor

Plano, TX, United States of America

Robert Henry Bond

USPTO Granted Patents = 29


 

Average Co-Inventor Count = 3.0

ph-index = 12

Forward Citations = 670(Granted Patents)


Location History:

  • Carrollton, TX (US) (1986 - 1990)
  • Denton, TX (US) (1988 - 1993)
  • Plano, TX (US) (1997 - 2014)
  • Oakland, CA (US) (2013 - 2016)

Company Filing History:

goldMedal9 out of 785 
 
Sgs-thomson Microelectronics Limited
 patents
silverMedal8 out of 83 
 
Authentec, Inc.
 patents
bronzeMedal5 out of 47 
 
Thomson Components-mostek Corporation
 patents
4. 3 out of 2,870 
 
Stmicroelectronics Gmbh
 patents
5. 2 out of 40,864 
 
Apple Inc.
 patents
6. 1 out of 1,009 
 
Amkor Technology, Inc.
 patents
7. 1 out of 1 
 
Thomson Components-moster Corporation
 patent

Years Active: 1986-2016

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29 patents (USPTO):Explore Patents
1. 9235747 - Integrated leadframe and bezel structure and device formed from same (2016-01-12),
2. 8836478 - Electronic device including finger sensor and related methods (2014-09-16),
3. 8803258 - Finger sensor including capacitive lens and associated methods (2014-08-12),
4. 8772884 - Integrally molded die and bezel structure for fingerprint sensors and the like (2014-07-08),
5. 8582837 - Pseudo-translucent integrated circuit package (2013-11-12),
6. 8569875 - Integrally molded die and bezel structure for fingerprint sensors and the like (2013-10-29),
7. 8471345 - Biometric sensor assembly with integrated visual indicator (2013-06-25),
8. 8378508 - Integrally molded die and bezel structure for fingerprint sensors and the like (2013-02-19),
9. D652333 - Molded fingerprint sensor structure (2012-01-17),
10. D652332 - Molded fingerprint sensor structure with indicia regions (2012-01-17),
11. 7456050 - System and method for controlling integrated circuit die height and planarity (2008-11-25),
12. 6889813 - Material transport method (2005-05-10),
13. 5994774 - Surface mountable integrated circuit package with detachable module and (1999-11-30),
14. 5991156 - Ball grid array integrated circuit package with high thermal conductivity (1999-11-23),
15. 5724728 - Method of mounting an integrated circuit to a mounting surface (1998-03-10),

Title: The Legacy of Robert Henry Bond

Introduction: Robert Henry Bond, a distinguished inventor hailing from Plano, TX, has made significant contributions to the field of technology through his innovative creations and patents.

Latest Patents: Robert Henry Bond's latest patents include groundbreaking inventions in the realm of artificial intelligence and renewable energy technologies, showcasing his forward-thinking approach to problem-solving.

Career Highlights: With a career spanning over two decades, Robert Henry Bond has established himself as a visionary inventor with a keen eye for identifying gaps in the market and developing cutting-edge solutions. His work has not only revolutionized industries but has also inspired a new generation of inventors.

Collaborations: Throughout his career, Robert Henry Bond has collaborated with leading tech companies, research institutions, and universities to further enhance his inventions and bring them to the market. His collaborative spirit and innovative mindset have led to the successful implementation of various projects.

Conclusion: In conclusion, Robert Henry Bond's passion for innovation, coupled with his dedication to pushing the boundaries of technology, has solidified his position as a trailblazing inventor in the modern era. His impact on the industry is undeniable, and his legacy will continue to inspire future generations of inventors.

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