Sgs-thomson Microelectronics Limited

Authentec, Inc.

Thomson Components-mostek Corporation

Stmicroelectronics Gmbh

Apple Inc.

Amkor Technology, Inc.

Thomson Components-moster Corporation

Robert Henry Bond

Michael A Olla

Giovanni Gozzini

Alan H Kramer

Barry L Morrison

Linn C Garrison

Steven Swendrowski

Michael J Hundt

Harry Michael Siegel

Wayne A Mulholland

Jerry S Cupples

Barbara R Mozdzen

Linda S Wilson

Daniel J Quinn

John D Pace

Ricky Parkinson

Tom Quoc Lao

Harold L Trammell

Ilya L Tsitovsky

Charles F Held

Yen T Nguyen

Harold Trammell

Quinn, Daniel J

An integrated leadframe and bezel structure includes a planar carrier frame, a plurality of bonding leads, a die pad region, and a bezel structure. The bezel structure includes a bending portion shaped and disposed to facilitate a portion of said bezel structure being bent out of the plane of said carrier frame. A sensor IC may be secured to the die pad region, and wire bonds made to permit external connection to the sensor IC. The bezel structure includes portions which are bent such that their upper extent is in or above a sensing surface. The assembly is encapsulated, exposing on the top surface part of the bezel portions and the upper surface of the sensor IC, and on the bottom surface the contact pads. Two or more bezel portions may be provided, one or more on each side of the sensor IC.

Integrated leadframe and bezel structure and device formed from same

An electronic device may include a housing and circuitry carried by the housing. The electronic device may also include a finger sensing device carried by the housing and coupled to the circuitry. The finger sensing device may include a mounting substrate, and a semiconductor interposer having a lower surface adjacent the mounting substrate. The finger sensing device may also include a plurality of semiconductor finger sensing die on an upper surface of the semiconductor interposer in side-by-side and abutting relation, and defining a finger sensing surface to receive at least one finger thereon.

Electronic device including finger sensor and related methods

A finger sensing device may include a mounting substrate, an integrated circuit (IC) die carried by the mounting substrate and having an array of electric field-based finger sensing elements, and first electrical connections coupling the mounting substrate and the IC die. In addition, the finger sensing device may include a protective plate attached over the array of electric field-based finger sensing elements and having a dielectric constant greater than 5 in all directions and a thickness greater than 40 microns to define a capacitive lens for the array of electric field-based finger sensing elements. The finger sensing device may also include an encapsulating material adjacent the mounting substrate and the IC die and around at least the first electrical connections.

Finger sensor including capacitive lens and associated methods

A biometric sensor device, such as a fingerprint sensor, comprises a substrate to which is mounted a die on which is formed a sensor array and at least one conductive bezel. The die and the bezel are encased in a unitary encapsulation structure to protect those elements from mechanical, electrical, and environmental damage, yet with a portion of the sensor array and the bezel exposed or at most thinly covered by the encapsulation or other coating material structure.

Integrally molded die and bezel structure for fingerprint sensors and the like

An integrated circuit (IC) package includes at least one light source disposed together with an IC structure within an encapsulation structure. The material forming the encapsulation structure is generally opaque. Accordingly, the light source and at least a portion of the IC are not visible to the unaided human eye. The thickness and geometry of the encapsulation are such that when the light source is caused to emit light, the encapsulation structure permits at least a portion of that light to be visible to a user. The IC may be a portion of a fingerprint sensor, exposed for receiving a fingertip of a user. The light source, or a plurality of such light sources, may be functional (e.g., providing visual indication of the of the condition or state of an item of hardware or software, assist the user in operation of a device), be primarily aesthetic, or a combination thereof.

Pseudo-translucent integrated circuit package

A biometric sensor assembly comprises a substrate to which is mounted a die containing sensor circuitry, at least one conductive bezel having a visual indicator region formed therein, and electrically connected to said die by way of said substrate, a light source, and a light-directing region directing light from the light source to the visual indicator region. The die, the light-directing region, and the bezel are encased in an encapsulation structure such that a portion of a surface of the die and the visual indication region are exposed or at most thinly covered by the encapsulation structure. The light-directing region directs light emitted by the light source within the encapsulation structure to the visual indicator region. Desired indicia in the visual indicator region may thereby be illuminated, while the die and bezel, and optionally the light source, are protected by the encapsulation structure.

Biometric sensor assembly with integrated visual indicator

Molded fingerprint sensor structure

Molded fingerprint sensor structure with indicia regions

A system and method is disclosed for controlling a height and a planarity of an integrated circuit die. In one advantageous embodiment of the invention, a plurality of patterned metal stops are fabricated on an integrated circuit substrate and covered with die attach material. An integrated circuit die is inserted into the die attach material and placed into a clamping mechanism of a molding machine. The clamping mechanism (1) compresses the die into the die attach material, (2) rotates the die into parallel alignment with the substrate, and (3) pushes the die into contact with the patterned metal stops. In this manner the die height and the die planarity are precisely controlled.

System and method for controlling integrated circuit die height and planarity

A controlled material transport method for carrying materials to and from workstations, test equipment, and processing and assembly tools in a common facility. The present invention includes a rigid 'robot vehicle' mountable to a passive track system, which can be routed to service all processing tools on the factory floor. The robot vehicle includes a hoist assembly and gripper assembly, which together perform such functions as picking up magazines, placing magazines, and loading magazines into the processing tools. The hoist assembly is capable of functioning in an operational envelope, which includes any target location within a 3-axis Cartesian coordinate system, to the extent of the range of motion of the hoist assembly. The hoist assembly also provides rigid and controlled z-axis travel, while being compact when retracted. The gripper assembly facilitates loading of the magazines, especially chute style magazines, which are commonly found on many existing processing tools.

Material transport method

A modular integrated circuit package is mounted on a surface of a printed circuit board. The integrated circuit package includes a rigid interposer releasably coupling a component module to a substrate member designed to be affixed to the printed circuit board. The substrate member has a first side with plural first electrical connectors for connection to the circuit board and a second side with second electrical connectors coupled to the first electrical connectors. The interposer includes a plurality of electrical connectors that couple electrical connectors of the component module to the second electrical connectors of the substrate member. The component module also includes plural clip members that engage a lower surface of the interposer to releasably couple the component module to the interposer.

Surface mountable integrated circuit package with detachable module and

An integrated circuit package with a path of high thermal conductivity is disclosed. A thermally conductive slug, formed of a material such as copper, is attached to an underside portion of a substrate, such as a printed circuit board or a ceramic substrate, through which an opening has been formed. An integrated circuit chip is mounted to one side of the slug exposed in the opening. An opposing surface of the slug lies below the plane of the underside of the substrate. The chip is wire bonded to the substrate, and is encapsulated in the conventional manner. Solder balls are attached to a portion of the underside of the substrate not covered by the slug in a ball-grid-array manner, for mounting to a circuit board. Upon mounting to the circuit board, a path of high thermal conductivity is provided between the chip and the circuit board, through the slug and the solder balls.

Ball grid array integrated circuit package with high thermal conductivity

A system for packaging integrated circuit components including a ball grid array substrate with a plurality of solder balls coupled to the substrate. A semiconductor device is mounted on the substrate and electrically coupled to the solder balls. One or more terminals are coupled to the substrate and electrically coupled to said semiconductor device. A detachable module contains auxiliary component. The module comprises a body portion for containing the component and one or more electrical connectors for mating with respective terminals to hold the module to the substrate and to electrically couple the component with the semiconductor device. The terminals may also be connected to the solder balls such that a component may be optionally provided either on the circuit board or in the detachable module.

Growing community of inventors

Plano, TX, United States of America

Robert Henry Bond