The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 25, 2008
Filed:
Jul. 01, 2003
Harry Michael Siegel, Hurst, TX (US);
Robert Henry Bond, Plano, TX (US);
Tom Quoc Lao, Murphy, TX (US);
Harry Michael Siegel, Hurst, TX (US);
Robert Henry Bond, Plano, TX (US);
Tom Quoc Lao, Murphy, TX (US);
STMicroelectronics, Inc., Carrollton, TX (US);
Abstract
A system and method is disclosed for controlling a height and a planarity of an integrated circuit die. In one advantageous embodiment of the invention, a plurality of patterned metal stops are fabricated on an integrated circuit substrate and covered with die attach material. An integrated circuit die is inserted into the die attach material and placed into a clamping mechanism of a molding machine. The clamping mechanism (1) compresses the die into the die attach material, (2) rotates the die into parallel alignment with the substrate, and (3) pushes the die into contact with the patterned metal stops. In this manner the die height and the die planarity are precisely controlled.