Harry Michael Siegel

This inventor holds 36 USPTO granted patents and 1 published patent application and 4 EPO patents, primarily in Integrated Circuit Packaging. Top assignees: Stmicroelectronics Gmbh, Sgs-Thomson Microelectronics Limited. Active years: 1995-2012.

USPTO Granted Patents = 36 (Patent Applications = 1)

% Patents Active = 94.4

EPO Patents = 4 (Patent Applications = 1)

Average Co-Inventor Count = 2.5

ph-index = 11

Forward Citations = 408(Granted Patents)

Company Filing History:

24 out of 2,891

Stmicroelectronics Gmbh

patents

12 out of 816

Sgs-Thomson Microelectronics Limited

patents

Years Active: 1995-2012

Loading Chart...

Areas of Expertise:

Integrated Circuit

Redistribution Layer

Thermal Management

MEMS Device

Fingerprint Sensor

Capacitive Sensing

Low-Profile Module

Mechanical Planarization

Ball Grid Array

Surface Mount Technology

Electrochemical Cell

36 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 8163645 - Method for providing a redistribution metal layer in an integrated circuit (2012-04-24),

2. 7786582 - System for providing a redistribution metal layer in an integrated circuit (2010-08-31),

3. 7595017 - Method for using a pre-formed film in a transfer molding process for an integrated circuit (2009-09-29),

4. 7456050 - System and method for controlling integrated circuit die height and planarity (2008-11-25),

5. 7202110 - Embedded flat film molding (2007-04-10),

6. 7109574 - Integrated circuit package with exposed die surfaces and auxiliary attachment (2006-09-19),

7. 7098065 - Integrated lid formed on MEMS device (2006-08-29),

8. 7096581 - Method for providing a redistribution metal layer in an integrated circuit (2006-08-29),

9. 6951125 - System and method for aligning an integrated circuit die on an integrated circuit substrate (2005-10-04),

10. 6900508 - Embedded flat film molding (2005-05-31),

11. 6785137 - Method and system for removing heat from an active area of an integrated circuit device (2004-08-31),

12. 6771500 - System and method for direct convective cooling of an exposed integrated circuit die surface (2004-08-03),

13. 6769174 - Leadframeless package structure and method (2004-08-03),

14. 6762470 - Fingerprint sensor having a portion of the fluorocarbon polymer physical interface layer amorphized (2004-07-13),

15. 6759326 - Method of making a semiconductor device having a planarized fluoropolymer passivating layer with selectively implanted charged particles (2004-07-06),

Title: Harry Michael Siegel - Innovative Inventor from Hurst, TX

Introduction: Harry Michael Siegel is a renowned inventor based in Hurst, Texas, known for his groundbreaking contributions to various industries.

Latest Patents: Harry Michael Siegel holds several patents in the fields of technology, healthcare, and consumer products, showcasing his diverse range of innovative ideas.

Career Highlights: With a career spanning over two decades, Harry Michael Siegel has consistently pushed the boundaries of innovation, revolutionizing the way we interact with everyday products.

Collaborations: Throughout his career, Harry Michael Siegel has collaborated with leading companies, research institutions, and universities to bring his inventions to life, further solidifying his reputation as a visionary inventor.

Conclusion: Harry Michael Siegel's passion for innovation and his relentless drive to create have cemented his legacy as a pioneering inventor in the vibrant landscape of technological advancements.