The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 29, 2009

Filed:

Jan. 31, 2002
Applicants:

Harry Michael Siegel, Hurst, TX (US);

Anthony M. Chiu, Richardson, TX (US);

Inventors:

Harry Michael Siegel, Hurst, TX (US);

Anthony M. Chiu, Richardson, TX (US);

Assignee:

STMicroelectronics, Inc., Carrollton, TX (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
B29C 45/02 (2006.01);
U.S. Cl.
CPC ...
Abstract

A system and method is disclosed for using a pre-formed film in a transfer molding process of the type that uses a transfer mold to encapsulate portions of an integrated circuit with a molding compound. A film of compliant material is pre-formed to conform the shape of the film to a mold cavity surface of the transfer mold. The pre-formed film is then placed adjacent to the surfaces of the mold cavity of the transfer mold. The mold cavity is filled with molding compound and the integrated circuit is encapsulated. The pre-formation of the film allows materials to be used that are not suitable for use with prior art methods.


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