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For the Inventor, By the Inventor

Osaka, Japan

Rihito Fukushima

This inventor holds 7 USPTO granted patents and 6 published patent applications. Top assignee: Nitto-Denko Corporation. Active years: 2024-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Rihito Fukushima. Retrieved from https://idiyas.com/inventor/rihito-fukushima

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 7 

% Patents Active = 100.0

Average Co-Inventor Count = 2.8

ph-index = 1


Company Filing History:

goldMedal7 out of 3,951 
 
Nitto-Denko Corporation
 patents

Years Active: 2024-2026

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7 patents (USPTO):Explore Patents
1. 12641719 - Wiring circuit board (2026-05-26),
2. 12563675 - Wiring circuit board assembly sheet (2026-02-24),
3. 12507341 - Wiring circuit board and producing method thereof (2025-12-23),
4. 12279367 - Wiring circuit board and producing method thereof (2025-04-14),
5. 12273997 - Wiring circuit board (2025-04-08),
6. 12137522 - Wiring circuit board (2024-11-05),
7. 12114438 - Manufacturing method for double-sided wiring circuit board and double-sided wiring circuit board (2024-10-08),

Title: Rihito Fukushima: Innovator in Wiring Circuit Board Technology

Introduction

Rihito Fukushima is a prominent inventor based in Osaka, Japan. He has made significant contributions to the field of wiring circuit board technology, holding a total of 7 patents. His innovative designs have paved the way for advancements in electronic components.

Latest Patents

Fukushima's latest patents include a wiring circuit board and a producing method thereof. This invention features a base insulating layer, a first wiring, and an intermediate insulating layer that covers the first wiring. Additionally, it includes a second wiring and two terminals that are electrically connected to the respective wirings. Another notable patent describes a wiring circuit board that consists of a base insulating layer, a conductive layer, and a metal protective film. This design enhances the functionality and reliability of electronic devices.

Career Highlights

Rihito Fukushima is currently employed at Nitto-Denko Corporation, where he continues to innovate and develop new technologies. His work has been instrumental in improving the efficiency and performance of wiring circuit boards.

Collaborations

Fukushima has collaborated with notable coworkers such as Hayato Takakura and Shusaku Shibata. Their combined expertise has contributed to the successful development of advanced wiring technologies.

Conclusion

Rihito Fukushima's contributions to wiring circuit board technology exemplify his dedication to innovation. His patents reflect a commitment to enhancing electronic components, making him a key figure in the industry.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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