The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 24, 2026

Filed:

Nov. 01, 2021
Applicant:

Nitto Denko Corporation, Osaka, JP;

Inventors:

Rihito Fukushima, Osaka, JP;

Takahiro Ikeda, Osaka, JP;

Shun Shiga, Osaka, JP;

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); H05K 1/03 (2006.01); H05K 1/11 (2006.01); H05K 3/00 (2006.01); H05K 3/10 (2006.01); H05K 3/18 (2006.01); H05K 1/18 (2006.01);
U.S. Cl.
CPC ...
H05K 3/108 (2013.01); H05K 1/0296 (2013.01); H05K 3/0097 (2013.01); H05K 3/18 (2013.01); H05K 1/0393 (2013.01); H05K 1/11 (2013.01); H05K 1/111 (2013.01); H05K 1/18 (2013.01); H05K 2201/09236 (2013.01); H05K 2203/0723 (2013.01);
Abstract

A wiring circuit board assembly sheet includes a wiring circuit board including a conductive pattern and a frame including a dummy conductive pattern. The frame includes a dummy formation region. The dummy formation region includes the dummy conductive pattern. The dummy formation region has a width of 5 mm from an edge of the wiring circuit board and a length identical to that of the wiring circuit board in a direction in which the edge extends. The difference between the percentage of the area of the conductive pattern to the area of the insulating base layer and the percentage of the area of the dummy conductive pattern to the area of the dummy formation region is 50% or less.


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