Company Filing History:
Years Active: 2024
Title: Shun Shiga - Innovator in Wiring Circuit Board Technology.
Introduction
Shun Shiga is a notable inventor based in Osaka, Japan. He has made significant contributions to the field of wiring circuit board technology. His innovative approach has led to the development of a unique assembly sheet that enhances the efficiency of wiring circuit boards.
Latest Patents
Shiga holds 1 patent for his invention titled "Wiring Circuit Board Assembly Sheet." This assembly sheet comprises a metal substrate, a wiring circuit structure portion, and a dummy structure portion. The metal substrate features a product region and an adjacent frame region. The wiring circuit structure portion is strategically placed on one surface of the metal substrate within the product region and includes a terminal portion. The dummy structure portion, located in the frame region, consists of multiple conductive layers aligned in the thickness direction and has a greater height than the terminal portion.
Career Highlights
Shun Shiga is currently employed at Nitto Denko Corporation, where he continues to innovate and contribute to advancements in circuit board technology. His work has been instrumental in improving the design and functionality of wiring circuit boards.
Collaborations
Shiga has collaborated with talented coworkers, including Shusaku Shibata and Teppei Niino. Their combined expertise has fostered a creative environment that encourages innovation and the development of cutting-edge technologies.
Conclusion
Shun Shiga's contributions to wiring circuit board technology exemplify the spirit of innovation. His patent for the wiring circuit board assembly sheet showcases his ability to solve complex engineering challenges. Through his work at Nitto Denko Corporation, he continues to push the boundaries of technology and inspire future advancements in the field.