The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 08, 2025

Filed:

Oct. 28, 2019
Applicant:

Nitto Denko Corporation, Osaka, JP;

Inventors:

Rihito Fukushima, Osaka, JP;

Hayato Takakura, Osaka, JP;

Shuichi Wakaki, Osaka, JP;

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/11 (2006.01); H05K 3/20 (2006.01);
U.S. Cl.
CPC ...
H05K 1/11 (2013.01); H05K 3/205 (2013.01); Y10T 29/5313 (2015.01);
Abstract

A wiring circuit board includes a base insulating layer, a conductive layer, and a metal protective film in order toward one side in a thickness direction. The conductive layer includes a signal wiring and a terminal continuous therewith. The signal wiring has one surface in the thickness direction, and first and second surfaces continuous with the one surface and disposed to face each other in a width direction. The terminal has one surface in the thickness direction, and the other surface disposed to face the one surface at the other side in the thickness direction at spaced intervals thereto. The other surface of the terminal is exposed from the base insulating layer toward the other side in the thickness direction. The metal protective film covers the one surface of the signal wiring and one surface of the terminal but not both first or second surfaces.


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