Nitto-Denko Corporation

Rihito Fukushima

Shusaku Shibata

Hayato Takakura

Teppei Niino

Naoki Shibata

Shuichi Wakaki

A wiring circuit board includes a base insulating layer, a first wiring layer disposed at one side in a thickness direction of the base insulating layer, and a cover insulating layer disposed on one surface in the thickness direction of the base insulating layer so as to cover the first wiring layer. The first wiring layer includes a first wiring portion in contact with one surface of the base insulating layer, and a second wiring portion in contact with one surface in the thickness direction of the first wiring portion. Both end surfaces in a width direction perpendicular to the thickness direction and a transmission direction of the second wiring portion are disposed inside in the width direction with respect to both end surfaces of the first wiring portion.

Wiring circuit board and producing method thereof

A wiring circuit board includes a base insulating layer; a first wiring disposed on the base insulating layer; an intermediate insulating layer disposed on the base insulating layer so as to cover the first wiring; a second wiring disposed on the intermediate insulating layer; a single layer first terminal, disposed on the base insulating layer, and electrically connected to the first wiring; and a single layer second terminal, disposed on the base insulating layer, and electrically connected to the second wiring. The first terminal is continuous with the first wiring. The second terminal is discontinuous from the second wiring. The wiring circuit board further includes a connecting portion disposed on the base insulating layer and continuous with the second terminal to electrically connect to the second wiring.

A wiring circuit board includes a base insulating layer, a conductive layer, and a metal protective film in order toward one side in a thickness direction. The conductive layer includes a signal wiring and a terminal continuous therewith. The signal wiring has one surface in the thickness direction, and first and second surfaces continuous with the one surface and disposed to face each other in a width direction. The terminal has one surface in the thickness direction, and the other surface disposed to face the one surface at the other side in the thickness direction at spaced intervals thereto. The other surface of the terminal is exposed from the base insulating layer toward the other side in the thickness direction. The metal protective film covers the one surface of the signal wiring and one surface of the terminal but not both first or second surfaces.

Wiring circuit board

A wiring circuit board includes a mounting region for mounting an electronic element and a circuit region surrounding the mounting region. The mounting region includes a terminal. The circuit region includes a circuit to be electrically connected to the terminal. The circuit region includes a metal support layer, a base insulating layer, and a conductive layer including the circuit. The mounting region does not include the metal support layer and includes a base insulating layer having an opening portion, and the conductive layer including the terminal. The terminal is disposed in the opening portion of the base insulating layer.

A method for manufacturing a double-sided wiring circuit board includes a first step of preparing a laminate and a second step. The laminate includes a metal core layer, insulating layers, and conductor layers. The insulating layer has a region and an opening that are adjacent to each other. The insulating layer has a region including a part facing the region in a thickness direction, and an opening adjacent to the region. The conductor layer includes a wiring portion and a conductive portion. In the second step, the first and second etching treatments for etching the metal core layer through the openings are carried out to form a via portion having a periphery surrounded by a space, extending between the regions, and connected to the conductive portions.

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Osaka, Japan

Rihito Fukushima