The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 23, 2025

Filed:

Oct. 12, 2020
Applicant:

Nitto Denko Corporation, Osaka, JP;

Inventors:

Rihito Fukushima, Osaka, JP;

Shusaku Shibata, Osaka, JP;

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0296 (2013.01);
Abstract

A wiring circuit board includes a base insulating layer, a first wiring layer disposed at one side in a thickness direction of the base insulating layer, and a cover insulating layer disposed on one surface in the thickness direction of the base insulating layer so as to cover the first wiring layer. The first wiring layer includes a first wiring portion in contact with one surface of the base insulating layer, and a second wiring portion in contact with one surface in the thickness direction of the first wiring portion. Both end surfaces in a width direction perpendicular to the thickness direction and a transmission direction of the second wiring portion are disposed inside in the width direction with respect to both end surfaces of the first wiring portion.


Find Patent Forward Citations

Fukushima, Rihito. (2025). Wiring circuit board and producing method thereof (U.S. Patent No. 12507341). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12507341

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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