Richard W Jarvis

Title: Richard W. Jarvis: Innovator in Semiconductor Technology

Introduction

Richard W. Jarvis is a prominent inventor based in Austin, TX, known for his significant contributions to semiconductor technology. With a total of 10 patents to his name, Jarvis has made remarkable advancements in the field, particularly in manufacturing methods and integrated circuit characterization.

Latest Patents

One of Jarvis's latest patents is the "Split manufacturing method for advanced semiconductor circuits." This innovative method involves manufacturing a front-end-of-line piece of a semiconductor die in a first manufacturing line, while a back-end-of-line piece is produced using a second, typically different, manufacturing line. The two pieces are then combined during a joining process to create a functional semiconductor die, which is subsequently tested for its operational capabilities.

Another notable patent is the "Drop-in test structure and methodology for characterizing an integrated circuit process flow and topography." This patent describes a drop-in test structure that is fabricated upon a production integrated circuit elevational profile. The method allows for characterizing an integrated circuit production methodology, enabling the identification of systematic and random defects in the production process.

Career Highlights

Richard W. Jarvis is currently associated with Advanced Micro Devices Corporation, where he continues to push the boundaries of semiconductor innovation. His work has been instrumental in enhancing the efficiency and reliability of semiconductor manufacturing processes.

Collaborations

Throughout his career, Jarvis has collaborated with notable colleagues, including Iraj Emami and Michael G. McIntyre. These partnerships have fostered a collaborative environment that encourages innovation and the sharing of ideas.

Conclusion

Richard W. Jarvis stands out as a key figure in the semiconductor industry, with a proven track record of innovation and collaboration. His contributions continue to shape the future of semiconductor technology, making a lasting impact on the field.