The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 27, 2007
Filed:
Nov. 27, 2002
Applicants:
Richard Wayne Jarvis, Kailua-Kona, HI (US);
Michael G. Mcintyre, Austin, TX (US);
Inventors:
Richard Wayne Jarvis, Kailua-Kona, HI (US);
Michael G. McIntyre, Austin, TX (US);
Assignee:
Advanced Micro Devices, Inc., Sunnyvale, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01R 31/26 (2006.01); H01L 21/66 (2006.01);
U.S. Cl.
CPC ...
Abstract
A front-end-of-line piece of a semiconductor die is manufactured in a first manufacturing line. A back-end-of-line piece of a semiconductor die is manufactured using a second manufacturing line, which will typically be different than the first manufacturing line. The front-end-of-line piece and the back-end-of-line piece are combined during a joining process to form a semiconductor die. The semiconductor die is subsequently tested to determine if the semiconductor die is a functional semiconductor die.