Richard Peter Sheridan

Title: Richard Peter Sheridan: Innovator in Integrated Circuit Packaging

Introduction

Richard Peter Sheridan is a notable inventor based in Gilbert, AZ (US). He has made significant contributions to the field of integrated circuit packaging, holding a total of 4 patents. His work focuses on improving the efficiency and effectiveness of semiconductor packaging technologies.

Latest Patents

Sheridan's latest patents include the "Bridge stack integrated circuit package system," which provides an innovative approach to mounting devices in an offset face-to-face configuration. This design allows for enhanced connectivity between the first and second devices. Another significant patent is the "Semiconductor package substrate fabrication method," which details a process for creating integrated circuit substrates with embedded lands. This method improves the manufacturing of high-density and low-cost mounting structures for integrated circuits by utilizing advanced etching and plating control features.

Career Highlights

Throughout his career, Sheridan has worked with prominent companies in the semiconductor industry, including Amkor Technology, Inc. and Stats Chippac Pte. Ltd. His experience in these organizations has contributed to his expertise in integrated circuit packaging and substrate fabrication.

Collaborations

Sheridan has collaborated with notable professionals in the field, including Ronald Patrick Huemoeller and David Jon Hiner. These partnerships have further enriched his work and innovations in semiconductor technology.

Conclusion

Richard Peter Sheridan's contributions to integrated circuit packaging and substrate fabrication have made a lasting impact on the industry. His innovative patents and collaborations reflect his commitment to advancing technology in this critical field.