The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 13, 2007
Filed:
Jun. 15, 2004
Richard Peter Sheridan, Gilbert, AZ (US);
Ronald Patrick Huemoeller, Chandler, AZ (US);
David Jon Hiner, Chandler, AZ (US);
Sukianto Rusli, Phoenix, AZ (US);
Richard Peter Sheridan, Gilbert, AZ (US);
Ronald Patrick Huemoeller, Chandler, AZ (US);
David Jon Hiner, Chandler, AZ (US);
Sukianto Rusli, Phoenix, AZ (US);
Amkor Technology, Inc., Chandler, AZ (US);
Abstract
A semiconductor package comprising a substrate having opposed top and bottom surfaces and a conductive pattern formed thereon. Disposed on the top surface of the substrate is a semiconductor die which is electrically connected to the conductive pattern. Also disposed on the top surface of the substrate is a leadframe which is electrically connected to the conductive pattern as well. A package body encapsulates the semiconductor die and partially encapsulates the leadframe such that a portion of the leadframe is exposed in one exterior surface of the package body, thus allowing a second semiconductor package to be stacked upon and electrically connected to the semiconductor package.