Company Filing History:
Years Active: 2012-2016
Title: Richard Chu: Innovator in Semiconductor Packaging
Introduction
Richard Chu is a prominent inventor based in Taipei, Taiwan. He has made significant contributions to the field of semiconductor packaging, holding a total of 6 patents. His innovative work focuses on enhancing the efficiency and effectiveness of wafer-level packaging technologies.
Latest Patents
One of Richard's latest patents is titled "Hermetic Wafer Level Packaging." This invention provides a wafer-level packaging solution that includes a first semiconductor wafer with a transistor device and a first bonding layer made from a specific material. Additionally, it features a second semiconductor wafer with a second bonding layer composed of a different material. Notably, one of these materials is aluminum-based, while the other is titanium-based. The design allows for a portion of the second wafer to be diffusively bonded to the first wafer through these bonding layers.
Another significant patent is the "Wafer Level Packaging Bond." This patent outlines a method for bonding multiple substrates. In this embodiment, a first substrate contains a first bonding layer, while a second substrate has a second bonding layer. The first bonding layer is made of silicon, and the second bonding layer consists of aluminum. The two substrates are bonded together, creating a bond region that features an interface between the silicon and aluminum layers.
Career Highlights
Richard Chu is currently employed at Taiwan Semiconductor Manufacturing Company Ltd. His work at this leading semiconductor manufacturer has allowed him to push the boundaries of technology in the industry. His innovative approaches have garnered attention and respect among his peers.
Collaborations
Richard has collaborated with notable coworkers, including Martin Liu and Yuan-Chih Hsieh. Their combined expertise has contributed to the advancement of semiconductor packaging technologies.
Conclusion
Richard Chu's contributions to semiconductor packaging through his innovative patents demonstrate his commitment to advancing technology in this field. His work continues to influence the industry and inspire future innovations.