The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 11, 2014
Filed:
Jul. 29, 2010
Richard Chu, Taipei, TW;
Martin Liu, Yonghe, TW;
Chia-hua Chu, Zhubei, TW;
Yuan-chih Hsieh, Hsinchu, TW;
Chung-hsien Lin, Hsinchu, TW;
Lan-lin Chao, Sindian, TW;
Chun-wen Cheng, Zhubei, TW;
Mingo Liu, Hsinchu, TW;
Richard Chu, Taipei, TW;
Martin Liu, Yonghe, TW;
Chia-Hua Chu, Zhubei, TW;
Yuan-Chih Hsieh, Hsinchu, TW;
Chung-Hsien Lin, Hsinchu, TW;
Lan-Lin Chao, Sindian, TW;
Chun-Wen Cheng, Zhubei, TW;
Mingo Liu, Hsinchu, TW;
Taiwan Semiconductor Manufacturing Company, Ltd., Hsin-Chu, TW;
Abstract
Provided is a wafer level packaging. The packaging includes a first semiconductor wafer having a transistor device and a first bonding layer that includes a first material. The packaging includes a second semiconductor wafer having a second bonding layer that includes a second material different from the first material, one of the first and second materials being aluminum -based, and the other thereof being titanium-based. Wherein a portion of the second wafer is diffusively bonded to the first wafer through the first and second bonding layers.