The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 11, 2014
Filed:
Mar. 23, 2010
Martin Liu, Yonghe, TW;
Richard Chu, Taipei, TW;
Hung Hua Lin, Taipei, TW;
Hsin-ting Huang, Bade, TW;
Jung-huei Peng, Jhubei, TW;
Yuan-chih Hsieh, Hsin-Chu, TW;
Lan-lin Chao, Sindian, TW;
Chun-wen Cheng, Zhubei, TW;
Chia-shiung Tsai, Hsin-Chu, TW;
Martin Liu, Yonghe, TW;
Richard Chu, Taipei, TW;
Hung Hua Lin, Taipei, TW;
Hsin-Ting Huang, Bade, TW;
Jung-Huei Peng, Jhubei, TW;
Yuan-Chih Hsieh, Hsin-Chu, TW;
Lan-Lin Chao, Sindian, TW;
Chun-Wen Cheng, Zhubei, TW;
Chia-Shiung Tsai, Hsin-Chu, TW;
Taiwan Semiconductor Manufacturing Company, Ltd., Hsin-Chu, TW;
Abstract
The present disclosure provides a method of bonding a plurality of substrates. In an embodiment, a first substrate includes a first bonding layer. The second substrate includes a second bonding layer. The first bonding layer includes silicon; the second bonding layer includes aluminum. The first substrate and the second substrate are bonded forming a bond region having an interface between the first bonding layer and the second bonding layer. A device having a bonding region between substrates is also provided. The bonding region includes an interface between a layer including silicon and a layer including aluminum.