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Randhir S Bubber

USPTO Granted Patents = 9 (Patent Applications = 1)

Average Co-Inventor Count = 5.3

ph-index = 8

Forward Citations = 412(Granted Patents)

Company Filing History:

Veeco Instruments Inc.

patents

Years Active: 2001-2006

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9 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 7071118 - Method and apparatus for fabricating a conformal thin film on a substrate (2006-07-04),

2. 7037574 - Atomic layer deposition for fabricating thin films (2006-05-02),

3. 6812126 - Method for fabricating a semiconductor chip interconnect (2004-11-02),

4. 6645847 - Microelectronic interconnect material with adhesion promotion layer and fabrication method (2003-11-11),

5. 6627995 - Microelectronic interconnect material with adhesion promotion layer and fabrication method (2003-09-30),

6. 6444263 - Method of chemical-vapor deposition of a material (2002-09-03),

7. 6365502 - Microelectronic interconnect material with adhesion promotion layer and fabrication method (2002-04-02),

8. 6294836 - Semiconductor chip interconnect barrier material and fabrication method (2001-09-25),

9. 6204204 - Method and apparatus for depositing tantalum-based thin films with organmetallic precursor (2001-03-20),

Title: The Innovative Contributions of Randhir S Bubber

Introduction

Randhir S Bubber is a notable inventor based in San Ramon, California. He has made significant contributions to the field of microelectronics through his innovative patents. With a total of nine patents to his name, Bubber has demonstrated a commitment to advancing technology and improving fabrication processes.

Latest Patents

Among his latest patents is a method and apparatus for fabricating a conformal thin film on a substrate. This invention involves introducing a gas from a gas inlet into an expansion volume associated with an atomic layer deposition (ALD) system. The gas flows through a diffuser plate adjacent to the expansion volume and a reaction chamber, where a protrusion located opposite the gas inlet reduces turbulence in the expansion volume. Another significant patent focuses on an atomic layer deposition (ALD) process that deposits thin films for microelectronic structures. This process utilizes plasma annealing at varying film thicknesses to achieve desired intrinsic film stress and breakdown film strength. The ALD process is particularly advantageous due to its near 100% step coverage and uniform properties along sidewalls, resulting in smooth, pure AlO films with improved breakdown strength.

Career Highlights

Randhir S Bubber has worked with several prominent companies, including CVC Products, Inc. and Veeco Instruments Inc. His experience in these organizations has allowed him to refine his skills and contribute to groundbreaking advancements in the field of microelectronics.

Collaborations

Throughout his career, Bubber has collaborated with esteemed colleagues such as Ajit P Paranjpe and Mehrdad M Moslehi. These collaborations have further enriched his work and expanded the impact of his inventions.

Conclusion

Randhir S Bubber's innovative contributions to the field of microelectronics through his patents and collaborations highlight his significant role as an inventor. His work continues to influence the industry and pave the way for future advancements.

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