Roth, Germany

Ralph Paetzold

USPTO Granted Patents = 19 

 

Average Co-Inventor Count = 3.7

ph-index = 6

Forward Citations = 161(Granted Patents)


Company Filing History:


Years Active: 2009-2019

where 'Filed Patents' based on already Granted Patents

19 patents (USPTO):

Title: Innovator Spotlight: Ralph Paetzold, Pioneering Electronic Component Encapsulation

Introduction:

Ralph Paetzold, a prolific inventor based in Roth, Germany, has been at the forefront of technological advancements in the field of electronic component encapsulation. With an impressive portfolio of 19 patents, Paetzold's innovative methods have revolutionized the way electronic components are protected from moisture and oxygen.

Latest Patents:

Paetzold's most recent patents showcase his expertise in developing cutting-edge encapsulation techniques. One notable invention is the "Method for producing an electronic component and electronic component," which involves the application of barrier layers using plasmaless atomic layer deposition (PLALD) and plasma-enhanced chemical vapor deposition (PECVD). This method ensures superior encapsulation of electronic components, safeguarding them from environmental factors.

Another groundbreaking patent by Paetzold is the "Device comprising an encapsulation unit," which features a sophisticated encapsulation arrangement with inorganic material layers to provide enhanced protection against moisture and oxygen. This device underscores Paetzold's commitment to advancing the durability and reliability of electronic components.

Career Highlights:

Throughout his career, Ralph Paetzold has made significant contributions to companies like Osram Opto Semiconductors GmbH and Osram OLED GmbH. His expertise and innovative spirit have played a crucial role in driving technological advancements within these organizations, positioning him as a key figure in the field of electronic component encapsulation.

Collaborations:

Paetzold's collaborative efforts with esteemed colleagues such as Karsten Heuser and Tilman Schlenker have further amplified his impact in the industry. By working alongside talented professionals, Paetzold has been able to exchange ideas, push boundaries, and collectively strive towards achieving excellence in electronic component encapsulation.

Conclusion:

In conclusion, Ralph Paetzold stands out as a trailblazing inventor whose pioneering work in electronic component encapsulation has reshaped the industry. With a strong focus on innovation and collaboration, Paetzold continues to drive technological progress and set new standards for the protection of electronic components. His patents and contributions undoubtedly mark him as a visionary in the realm of encapsulation technology.

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