The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 09, 2017

Filed:

Jan. 24, 2014
Applicants:

Christian Schmid, Regensburg, DE;

Tilman Schlenker, Nittendorf, DE;

Heribert Zull, Regensburg, DE;

Ralph Paetzold, Roth, DE;

Markus Klein, Tegerneheim, DE;

Karsten Heuser, Erlangen, DE;

Inventors:

Christian Schmid, Regensburg, DE;

Tilman Schlenker, Nittendorf, DE;

Heribert Zull, Regensburg, DE;

Ralph Paetzold, Roth, DE;

Markus Klein, Tegerneheim, DE;

Karsten Heuser, Erlangen, DE;

Assignee:

OSRAM OLED GmbH, Regensburg, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 33/62 (2010.01); H01L 33/48 (2010.01); H01L 33/54 (2010.01);
U.S. Cl.
CPC ...
H01L 33/62 (2013.01); H01L 33/486 (2013.01); H01L 33/54 (2013.01); H01L 2924/01078 (2013.01); H01L 2924/01079 (2013.01);
Abstract

A method for producing an electronic component comprising barrier layers for the encapsulation of the component comprises, in particular, the following steps: providing a substrate with at least one functional layer, applying at least one first barrier layer on the functional layer via plasma enhanced atomic layer deposition (PEALD), and applying at least one second barrier layer on the functional layer by means of plasma-enhanced chemical vapor deposition (PECVD), where the at least one first barrier layer is applied at a temperature of less than 100° C.


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