The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 17, 2018

Filed:

Jan. 08, 2014
Applicants:

Christian Schmid, Regensburg, DE;

Tilman Schlenker, Nittendorf, DE;

Heribert Zull, Regensburg, DE;

Ralph Paetzold, Roth, DE;

Markus Klein, Tegernheim, DE;

Karsten Heuser, Erlangen, DE;

Inventors:

Christian Schmid, Regensburg, DE;

Tilman Schlenker, Nittendorf, DE;

Heribert Zull, Regensburg, DE;

Ralph Paetzold, Roth, DE;

Markus Klein, Tegernheim, DE;

Karsten Heuser, Erlangen, DE;

Assignee:

OSRAM OLED GmbH, Regensburg, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/29 (2006.01); H01L 21/56 (2006.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01); C23C 16/02 (2006.01); C23C 16/455 (2006.01); C23C 16/50 (2006.01); C23C 16/54 (2006.01); H01L 31/0216 (2014.01); H01L 31/18 (2006.01); H01L 51/56 (2006.01); H01L 51/52 (2006.01); H01L 21/02 (2006.01); H01L 51/00 (2006.01);
U.S. Cl.
CPC ...
H01L 21/56 (2013.01); C23C 16/0272 (2013.01); C23C 16/45525 (2013.01); C23C 16/50 (2013.01); C23C 16/54 (2013.01); H01L 21/02274 (2013.01); H01L 21/02282 (2013.01); H01L 23/293 (2013.01); H01L 23/31 (2013.01); H01L 23/3135 (2013.01); H01L 23/564 (2013.01); H01L 31/0216 (2013.01); H01L 31/18 (2013.01); H01L 51/0001 (2013.01); H01L 51/5237 (2013.01); H01L 51/5256 (2013.01); H01L 51/56 (2013.01); H01L 2924/0002 (2013.01);
Abstract

A device that includes a component and an encapsulation arrangement for the encapsulation of the component with respect to moisture and/or oxygen, wherein the encapsulation arrangement has a first layer and thereabove a second layer on at least one surface of the component, the first layer and the second layer each comprise an inorganic material, and the second layer is arranged directly on the first layer.


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