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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10297469 B1

PDFFull Text
Date of Patent:
May. 21, 2019

Filed:

Nov. 13, 2014

Method for producing an electronic component and electronic component

Applicants:

Christian Schmid, Regensburg, DE;

Tilman Schlenker, Nittendorf, DE;

Heribert Zull, Regensburg, DE;

Ralph Paetzold, Roth, DE;

Markus Klein, Tegernheim, DE;

Karsten Heuser, Erlangen, DE;

Inventors:

Christian Schmid, Regensburg, DE;

Tilman Schlenker, Nittendorf, DE;

Heribert Zull, Regensburg, DE;

Ralph Paetzold, Roth, DE;

Markus Klein, Tegernheim, DE;

Karsten Heuser, Erlangen, DE;

Assignee:

OSRAM OLED GmbH, Regensburg, DE;

Attorney:

Cozen O'Connor

Primary Examiner:

David C Spalla

Int. Cl.
CPC ...
H01L 21/56 (2006.01); H01L 21/02 (2006.01); H01L 31/18 (2006.01); H01L 51/00 (2006.01); H01L 51/56 (2006.01); H01L 23/29 (2006.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01); C23C 16/02 (2006.01); C23C 16/455 (2006.01); C23C 16/50 (2006.01); C23C 16/54 (2006.01); H01L 31/0216 (2014.01); H01L 51/52 (2006.01); H01L 33/62 (2010.01); H01L 33/48 (2010.01); H01L 33/54 (2010.01);
U.S. Cl.
CPC ...
H01L 21/56 (2013.01); C23C 16/0272 (2013.01); C23C 16/45525 (2013.01); C23C 16/50 (2013.01); C23C 16/54 (2013.01); H01L 21/02274 (2013.01); H01L 21/02282 (2013.01); H01L 23/293 (2013.01); H01L 23/31 (2013.01); H01L 23/3135 (2013.01); H01L 23/564 (2013.01); H01L 31/0216 (2013.01); H01L 31/18 (2013.01); H01L 33/62 (2013.01); H01L 51/0001 (2013.01); H01L 51/5237 (2013.01); H01L 51/5256 (2013.01); H01L 51/56 (2013.01); H01L 33/486 (2013.01); H01L 33/54 (2013.01); H01L 2924/0002 (2013.01); H01L 2924/01078 (2013.01); H01L 2924/01079 (2013.01);
Abstract

A method for producing an electronic component and an electronic component, having barrier layers for the encapsulation of the component. The method involves providing a substrate () with at least one functional layer (), and an electronic component, applying at least one first barrier layer () on the functional layer () by way of plasmaless atomic layer deposition (PLALD), and applying at least one second barrier layer () on the functional layer () by way of plasma-enhanced chemical v0apor deposition (PECVD).

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