Tianjin, China

Qingchun He

USPTO Granted Patents = 9 

Average Co-Inventor Count = 3.4

ph-index = 2

Forward Citations = 14(Granted Patents)


Location History:

  • Tainjin, CN (2015)
  • Tianjin, CN (2011 - 2017)

Company Filing History:


Years Active: 2011-2017

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9 patents (USPTO):Explore Patents

Title: Innovations by Qingchun He in Semiconductor Technology

Introduction

Qingchun He is a prominent inventor based in Tianjin, China. He has made significant contributions to the field of semiconductor technology, holding a total of 9 patents. His work focuses on enhancing the efficiency and performance of semiconductor devices.

Latest Patents

One of Qingchun He's latest patents is for packaged semiconductor devices having ribbon wires. This innovation replaces traditional circular bond wires with rectangular ribbon wires, allowing for smaller devices with improved thermal dissipation capabilities. The design encapsulates the die and ribbon wires in a molding compound, exposing the device leads without the need for lead frames.

Another notable patent involves a semiconductor device and lead frame featuring vertical connection bars. This design includes a lead frame with a die support area and surrounding leads, with a semiconductor die mounted and electrically connected to the leads. The vertical connection bars link the inner row leads to the outer row leads before the molding process, enhancing the overall structure of the package body.

Career Highlights

Qingchun He is currently employed at Freescale Semiconductor, Inc., where he continues to innovate in semiconductor technology. His work has been instrumental in developing advanced packaging solutions that improve device performance and reliability.

Collaborations

He has collaborated with notable coworkers, including Peng Liu and Ping Wu, contributing to various projects that push the boundaries of semiconductor technology.

Conclusion

Qingchun He's contributions to semiconductor technology through his innovative patents have significantly impacted the industry. His work exemplifies the importance of continuous innovation in enhancing device performance and efficiency.

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