The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 08, 2014
Filed:
Aug. 16, 2011
Applicants:
Jie Yang, Tianjin, CN;
Qingchun He, Tianjin, CN;
Hanmin Zhang, Tianjin, CN;
Inventors:
Assignee:
Freescale Semiconductor, Inc., Austin, TX (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/11 (2006.01);
U.S. Cl.
CPC ...
Abstract
An electrical connection includes a first wire bonded to adjacent bond pads proximate to an edge of a die and a second wire having one end bonded to a die bond pad distal to the die edge and a second end bonded to a lead finger of a lead frame or a connection pad of a substrate. The second wire crosses and is supported by the first wire. The first wire acts as a brace that prevents the second wire from touching the edge of the die. The first wire also prevents the second wire from excessive lateral movement during encapsulation.