This inventor holds 3 USPTO granted patents and 3 published patent applications. Top assignee: Freescale Semiconductor,inc.. Active years: 2013-2017.
Company Filing History:
Years Active: 2013-2017
Title: Innovations by Hanmin Zhang
Introduction
Hanmin Zhang is a notable inventor based in Tianjin, China. He has made significant contributions to the field of semiconductor technology, holding a total of 3 patents. His work focuses on enhancing the efficiency and performance of packaged semiconductor devices.
Latest Patents
One of Hanmin Zhang's latest patents is for packaged semiconductor devices that utilize ribbon wires instead of traditional circular bond wires. This innovation allows for smaller devices with improved thermal dissipation capabilities. The design encapsulates the die and ribbon wires in a molding compound, exposing the device leads without the need for lead frames. Another patent involves a unique electrical connection that includes a brace wire to support a second wire, preventing it from touching the edge of the die and ensuring stability during encapsulation.
Career Highlights
Hanmin Zhang is currently employed at Freescale Semiconductor, Inc., where he continues to develop cutting-edge technologies in semiconductor packaging. His expertise has positioned him as a key player in the industry, contributing to advancements that benefit various applications.
Collaborations
Throughout his career, Hanmin has collaborated with talented individuals such as Qingchun He and Peng Liu. These partnerships have fostered an environment of innovation and creativity, leading to the development of groundbreaking technologies.
Conclusion
Hanmin Zhang's contributions to semiconductor technology exemplify the spirit of innovation. His patents reflect a commitment to improving device performance and efficiency. As he continues to work at Freescale Semiconductor, Inc., his future endeavors are sure to make a lasting impact in the field.