The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 03, 2015
Filed:
Nov. 11, 2013
Applicants:
Peng Liu, Tianjin, CN;
Qingchun He, Tianjin, CN;
Zhaobin Qi, Tianjin, CN;
Liqiang Xu, Tianjin, CN;
Tong Zhao, Tianjin, CN;
Inventors:
Peng Liu, Tianjin, CN;
Qingchun He, Tianjin, CN;
Zhaobin Qi, Tianjin, CN;
Liqiang Xu, Tianjin, CN;
Tong Zhao, Tianjin, CN;
Assignee:
Freescale Semiconductor, Inc., Austin, TX (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/44 (2006.01); H01L 21/48 (2006.01); H01L 21/50 (2006.01); H01L 23/495 (2006.01); H01L 25/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49575 (2013.01); H01L 25/50 (2013.01); H01L 2924/0002 (2013.01); H01L 23/49503 (2013.01); H01L 23/4952 (2013.01);
Abstract
A semiconductor device includes a lead frame having a down bond area, a die attach area and a dam formed between the down bond area and the die attach area. A bottom of the dam is attached on a surface of the lead frame. The dam prevents contamination of the down bond area from die attach material, which may occur during a die attach process.