Philip Yashar

Title: The Innovative Mind of Philip Yashar: A Look at His Patents and Contributions

Introduction

Philip Yashar, an accomplished inventor based in Portland, Oregon, has made significant strides in the field of integrated circuit technologies. With a total of three patents to his name, he has played a crucial role in enhancing electronic device performance through his innovative approaches.

Latest Patents

One of Yashar's latest patents is centered around "Copper Interconnect Cladding." This invention involves an integrated circuit that includes a front end of line (FEOL) circuit featuring a transistor. Above this FEOL circuit, a back end of line circuit incorporates insulator material with an interconnect feature consisting of a copper core. This feature also includes a first layer made distinct from the core, and a second layer that combines different metals, providing a robust solution for interconnect technology. Specifically, the second layer may consist of ruthenium and cobalt.

Another notable patent is for a "Low Resistance Interconnect." In this embodiment, a transistor is formed on a substrate, with a metal interconnect situated in a dielectric layer above the transistor. This interconnect features a copper layer separated from the dielectric layer by a barrier layer, which consists of tantalum and niobium, ensuring low resistance and improved performance.

Career Highlights

Philip Yashar is currently associated with Intel Corporation, where his groundbreaking work is pushing the boundaries of technology. His expertise in integrated circuits has led to improvements in the efficiency and reliability of electronic devices, marking him as a key player in the tech industry.

Collaborations

Throughout his career, Yashar has collaborated with talented coworkers such as Gokul Malyavanatham and Rohan N Akolkar. Together, they have contributed to advancing technologies that impact the performance of various electronic applications.

Conclusion

Philip Yashar's innovative patents, coupled with his collaborative efforts at Intel Corporation, demonstrate his commitment to excellence in the field of electronics. His contributions not only enhance the functionality of integrated circuits but also pave the way for future advancements in technology.